본문
| Hi-Bond® UNIVERSAL | |||||||||||||
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| 제품개요 | |||||||||||||
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Multi purpose universal adhesive 8th generation bonding system containing 10-MDP and MBG (Mesoporous BioGlass) filler. Hi-Bond™ is a MBG(mesoporous BAG) incorporated one-step dental adhesive. Hi-Bond™ can produce hydroxyapatite by contacting with saliva through BAG. It has sufficient bonding strength, remineralization effect and preventive effect on post-operative sensitivity.
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페이지 정보
- 이전글Any-Core® 25.10.24
- 다음글K-Bond Universal 25.09.03
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